1. Assist the Micro Assembly Engineer in die attach and wirebonding for prototype and production products.
2. Operate microelectronics assembly equipment, including die attach and wirebonding machines, in accordance with approved procedures and work instructions.
3. Perform operation and routine maintenance of assembly equipment and tooling.
4. Handle and assemble RF ICs, capacitors, inductors, substrates, and other microelectronic components using proper ESD controls and handling procedures.
5. Support prototype, first article, and pre-production builds by performing assembly and inspection tasks.
6. Conduct visual inspection of assembled products using microscopes and other inspection equipment to ensure compliance with workmanship standards.
7. Assist in rework and repair activities as required to meet product quality requirements.
8. Accurately record production and assembly data, ensuring traceability and compliance with quality system requirements.

Requirements

• Minimum NITEC/ Diploma/ Degree in Electrical & Electronics Engineering
• Preferably with experiences in die attach and wire bonding

Interested candidates please send in your resume to:
Topaz Liang Huimin (CEI No. R1104500), email to: west1@recruitexpress.com.sg
EA License No: 99C4599